| Technical Bulletins |
| 100 Screen Cleaner |
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100 SCREEN CLEANER is a nonchlorinated, water soluble, slow evaporating, mild odor cleaner formulated to remove uncured solder mask, uncured legend ink, and uncured primary image ink from screens and parts. 100 is noncorrosive to aluminum screen chases and is safe for use on stainless steel and polyester screen fabric. |
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| 120 Screen Cleaner |
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Screen Cleaner 120 is a water rinsable nonchlorinated cleaner which dissolves uncured solder mask, legend ink, and screen resists from screens and boards. Screen Cleaner 120 is nonflammable, safe and economical to use. 120 is safe to use on aluminum, stainless steel and most synthetic fabrics. |
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| 130 Screen Emulsion Remover |
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Screen Emulsion Remover 130 is a mildly acidic screen cleaner formulated for diazo and bichromate emulsions, direct/indirect and transfer films on stainless, polyester or nylon screens. Removal of stencil is fast and efficient. 130 is low in odor and is safe to use on aluminum, stainless steel, polyester and nylon. |
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| 140 Screen Cleaner |
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Screen Cleaner 140 is a water rinsable nonchlorinated cleaner which dissolves uncured solder mask, legend ink, and screen resists from screens and boards. Screen Cleaner 140 is nonflammable, safe and economical to use. 140 is safe to use on aluminum, stainless steel and most synthetic fabrics. |
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| 1020 Defoamer |
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DEFOAMER 1020 was designed to be in conveyorized spray machines without adversely affecting the equipment. DEFOAMER 1020 may be used anywhere that is necessary to control excessive foaming. |
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| 1030 Defoamer |
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AntiFoam 1030 is an outstanding defoamer for all aqueous and semiaqueous resist strippers. This anionic surface active agent disperses quickly, forming a thin film over the surface of the photoresist stripper chemistry to eliminate and control foam. |
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| 3015 Micro Etch |
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Micro Etch 3015 is an excellent copper cleaning solution used as the first step in producing a clean, micro etched copper surface during preclean operations. Micro Etch 3015 will clean, deoxidize, remove light oils and microetch bare copper printed circuit boards. Micro Etch rate is stable at 4080 millionths per minute. |
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| 3530 Alkaline Cleaner |
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Alkaline Cleaner 3530 is a general purpose, sprayable cleaner for removing oxides and other contaminants from plated tin or tinlead deposits prior to reflow or soldering. It restores the metallic surface to the "asplated" condition to promote better solderability. |
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| 3535 Cleaner/Adhesion Promoter |
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CircuitWeb Chemistryes 3535 Cleaner/Adhesion Promoter is recommended for inner layers, flexible composites and coverlays. It is an acid cleaning system that removes foil manufacturers chromate conversion coatings and conditions substrates for direct dry film lamination without a microetch. The CWC 3535 removes oils, fingerprints, oxides, tarnish and chromates leaving a treated surface that retards oxidation and enhances the adhesion of dry film photopolymers. CWC 3535 eliminates the need for any additional process chemistries prior to lamination. |
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| 3540 Acid Cleaner |
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Acid Cleaner 3540 is an acidic, minimal etching sprayable cleaner designed to remove oxides, antitarnish and chromate coatings, fingerprints, and other shop soils from copper surfaces. It recommended and very effective in conveyorized spray cleaning prior to dry film lamination, oxide treatment, and hot air leveling. Acid Cleaner 3540 is ideal for all processes where a clean, oxide free surface is desirable. 3540 contains no organic solvents and rinses completely and easily in cold or warm water. |
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| 3541 Acid Cleaner |
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Acid Cleaner 3541 is an acidic copper cleaner designed to remove light oils, such as fingerprints in order to give a clean water break surface. Acid Cleaner 3541, when used in conjunction with the PCI 3015 MicroEtch, effectively prepares the copper surface for subsequent operations. Applications include cleaning copper surfaces prior to dry film lamination in oxide lines and as a preplate cleaner. 3541 is formulated for use in either spray or immersion operations. |
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| 3585 Acid Soak Cleaner |
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Acid Soak Cleaner 3585 is a blend of acids, surfactants and solvents developed to penetrate and dissolve surface films. The Acid Soak Cleaner 3585 also will remove light oils, finger prints and condition holes for plated through process. The Acid Soak Cleaner 3585 was designed to clean boards when alkaline soluble dry film or screening inks are being used. |
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| 4300E Solder Stripper |
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Solder Stripper 4300E is a nitric acid based, singlestep liquid formulated for stripping tin and tinalloy from copper. Solder Stripper 4300E minimizes attack on the copper surface and leaves the copper with a shiny appearance suitable for AOI The most effective use of Solder Stripper 4300E is in a conveyorized spray system. Spent Solder Stripper 4300E is easily waste treated by neutralization and filtration. |
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| 4360 Solder Stripper |
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Solder Stripper 4360 is a nitric acid based, singlestep liquid formulated for stripping tin and tinalloy from copper. Solder Stripper 4360 minimizes attack on the copper surface and leaves the copper with a shiny appearance suitable for AOI The most effective use of Solder Stripper 4360 is in a conveyorized spray system. Spent Solder Stripper 4360 is easily waste treated by neutralization and filtration. |
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| 4400A Solder Stripper |
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Solder Stripper 4400A is step one of a two step nonperoxide tin or tin/lead stripping process which does not attack copper or laminate, and leaves copper bright, clean and oxide free. |
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| 4400B Copper Conditioner |
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Copper Conditioner 4400B is a very consistent intermetallic layer remover and copper cleaner. It may be used full strength before solder mask lamination and solder leveling. When removing the intermetallic layer, it is used at 50% concentration. Stripping time is less than a minute, and is adjustable with either water or concentrate additions. The brighteners in Copper Conditioner 4400B will leave copper surfaces bright and clean. |
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| 5014 Solder Levelling Flux |
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5014 is a unique blend of ingredients formulated for use in the hot air levelling process. The 5014 will remove light copper oxides and lays down a protective layer of flux to protect soldermask and promote good solderability of copper pads. The 5014 will provide a bright uniform solder finish with good rinsability. The 5014 is a solvent free flux, nonfoaming formulation that is compatible with LPI and dry film soldermasks. |
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| 5016 Solder Assist Fluid |
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Solder Assist Fluid 5016 is formulated for use as a solder blanket oil for horizontal hot air leveling equipment. The Solder Assist Fluid 5016 prevents the formation of dross by eliminating contact of oxygen to molten solder. When used in a recirculation or oil injection system, the 5016 will lubricate pumps and internal transport mechanisms of horizontal hot air equipment reducing solder webbing. |
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| 5019 Solder Leveling Flux |
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5019 is a unique blend of ingredients formulated for use in the hot air leveling process. The 5019 will remove light copper oxides and lays down a protective layer of flux to protect soldermask and promote good solderability of copper pads. The 5019 will provide a bright uniform solder finish with good rinsability. The 5019 is a solvent free flux, nonfoaming formulation that is compatible with LPI and dry film soldermasks. |
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| 5056 IR Flux |
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IR Flux 5056 is formulated for use in infrared fusing systems producing superior reflow characteristics with excellent side wall coverage. IR Flux 5056 with a low acid activation system rapidly deoxidizes the tin/lead surface allowing for less equipment degradation and lower power consumption to promote excellent reflow 5056 is nonfoaming in water spray rinsing and 100% water soluble. With low viscosity 5056 has very efficient metering and roller impregnation. |
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| 6000 Ultra Strip |
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ULTRA STRIP 6000 was formulated to be a high performance stripper for aqueous processable dry film. ULTRA STRIP 6000 contains no organic solvents. It combines extremely fast strip times and high bathing loading. The versatility of ULTRA STRIP 6000 allows it to be run in steady state or batch mode while giving excellent performance in either mode of operation. ULTRA STRIP 6000 may be used on any aqueous processable resist. |
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| 6450 Resist Stripper |
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RESIST STRIPPER 6450 was formulated to be a high performance stripper for aqueous processible dry films and liquid resists. RESIST STRIPPER 6450 contains no organic solvents. It combines extremely fast strip times and high bathing loading. The versatility of RESIST STRIPPER 6450 allows it to be run in steady state or batch modes while giving excellent performance in either mode of operation. RESIST STRIPPER 6450 may be used on any aqueous processable resist. |
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| 6600 Ultra Strip |
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ULTRA STRIP 6600 was formulated to be a high performance stripper for aqueous dry film. ULTRA STRIP 6600 contains no organic solvents. It combines extremely fast strip times and high bathing loading. The versatility of ULTRA STRIP 6600 allows it to be run in steady state or batch mode while giving excellent performance in either mode of operation. ULTRA STRIP 6600 may be used on any aqueous resist. |
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| 6600 Ultra Strip |
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Titration procedures |
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| 6600T Ultra Strip |
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ULTRA STRIP 6600T was formulated to be a high performance stripper for aqueous processible dry film. ULTRA STRIP 6600T contains no organic solvents. It combines extremely fast strip times and high bathing loading. The versatility of ULTRA STRIP 6600T allows it to be run in steady state or batch mode while giving excellent performance in either mode of operation. ULTRA STRIP 6600T may be used on any aqueous processible resist. |
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| 7010 Descaler |
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Descaler 7010 is a formulated liquid for cleaning the process chambers in developing or stripping equipment of scaled and hardened dryfilm resists. When used during the cleaning cycle of the chamber, Descaler 7010 solubilizes scum produced from the development of polymerized photopolymer, emulsifies residual defoamer left from the developing solution, and dissolves hard water deposits. |
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| 7031 Pre & Post Cleaner |
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Pre & Post Cleaner 7031 is an effective dirt and oil remover to be used in a dip or spray application as a generalpurpose alkaline cleaner. This cleaner does not contain corrosive salts or aggressive and hazardous solvents, so it leaves no absorbed film on the surface. The Pre & Post Cleaner 7031 is also effective for post cleaning in the hot air leveling process to help achieve lower ionic contamination levels. |
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| 7050 Tape & Residue Remover |
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Tape & Residue Remover 7050 is formulated to quickly and easily remove glue resins and tape residues from circuit boards and similar surfaces. 7050 does not contain any chlorinated solvents and is effective at ambient temperatures. |
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| 8005 Soldermask Remover |
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Soldermask Remover 8005 is designed to strip uncured and fully cured soldermask from printed circuit boards, without damage to the laminate. Stripping is accomplished at elevated temperatures, and Soldermask Remover 8005 is rinsed off easily in water. |
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| 8005 Soldermask Stripper |
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Soldermask Stripper 8005 is designed to strip uncured and fully cured soldermask from printed circuit boards, without damage to the laminate. Stripping is accomplished at elevated temperatures, and Soldermask Stripper 8005 is rinsed off easily in water. |
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| 9010 Anti Tarnish |
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ANTI TARNISH 9010 is a liquid material added to the final water rinse to provide tarnish resistance to copper even if exposed to very humid conditions. The coating is clear and can be easily removed for subsequent operations. 9010 prevents discoloration of copper plate parts and increases the adhesion of silk screen ink, photoresist film, and solder mask on printed circuits boards. 9010 is used on printed circuit boards prior to solder maks application to stop the deep discoloration caused by baking one side before masking the other. |
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| FL40 Developer Concentrate |
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DEVELOPER CONCENTRATE FL40 Plus is a potassium carbonate based solution designed to be used for developing fully aqueous photoresists. When water hardness or equipment maintenance with scale buildup is a concern, FL40 Plus provides excellent performance. |
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| FL40CE Developer Concentrate |
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DEVELOPER CONCENTRATE FL40CE is a high purity potassium carbonate concentrate solution. The FL40CE is designed to be used for developing fully aqueous photoresists and LPI soldermasks. FL40CE provides excellent performance. |
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| FL-40 Developer Concentrate |
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DEVELOPER CONCENTRATE FL40 is a high purity potassium carbonate concentrate solution. The FL40 is designed to be used for developing fully aqueous photoresists and LPI soldermasks. FL40 provides excellent performance. |
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| FL45C Developer Concentrate |
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DEVELOPER CONCENTRATE FL45C is a potassium carbonate based solution designed to be used for developing fully aqueous photoresists and LPI Soldermask. When equipment maintenance with scale buildup is a concern, FL45C provides excellent performance. |
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